论文标题
部分可观测时空混沌系统的无模型预测
Front-end Electronics for Timing with pico-seconds precision using 3D Trench Silicon Sensors
论文作者
论文摘要
下一代对撞机实验需要在空间分辨率（$μ\ text {m} $），辐射硬度（$ 10^{17} 〜1〜 $ MEV N $ _ {eq}/$ cm $^2 $^2 $^2 $）和定时分辨率（PS）（TENSENS）方面的跟踪探测器（$μ\ text {m} $），辐射硬度（$ 10^{17} 〜1〜1〜1〜1〜1〜1〜1〜1〜1〜1〜1〜1〜1〜1〜1〜1〜1〜1〜1〜1〜1〜1〜1〜1〜1〜1〜1〜1〜1〜1〜1）。最近在TimesPot计划中开发的3D Silicon传感器提供了可行的解决方案，可以应付此类苛刻的要求。为了准确地表征这些新传感器的定时性能，已经设计，组装和测试了基于离散活动组件的几个读出板。同一电子设备也适用于每当按顺序和10 ps以下的时间进行计时性能时，需要表征相似的像素传感器。本文介绍了前端电子设备所需的一般特征，以利用具有快速时序能力的固态传感器，尤其是在快速3D硅传感器的测试和表征中展示了开发的电子设备的性能。
The next generation of collider experiments require tracking detectors with extreme performance capabilities in terms of spatial resolution (tens of $μ\text{m}$), radiation hardness ($10^{17}~1~$MeV n$_{eq}/$cm$^2$) and timing resolution (tens of ps). 3D silicon sensors, recently developed within the TimeSPOT initiative, offer a viable solution to cope with such demanding requirements. In order to accurately characterize the timing performance of these new sensors, several read-out boards, based on discrete active components, have been designed, assembled, and tested. The same electronics is also suitable for characterization of similar pixel sensors whenever timing performance in the order and below 10 ps is a requirement. This paper describes the general characteristics needed by front-end electronics to exploit solid-state sensors with fast timing capabilities and in particular, showcases the performance of the developed electronics in the testing and characterization of fast 3D silicon sensors.
