论文标题
高级包装技术的电力传递的设计空间探索
Design Space Exploration of Power Delivery For Advanced Packaging Technologies
论文作者
论文摘要
在本文中，对多芯片2.5-D和3-D IC技术进行了动力输送网络的设计空间探索。本文的重点是用于电源噪声（PSN）抑制的电压调节器模块（VRMS）的有效放置。已经分析并比较了多个包装VRM配置。此外，还研究了3D IC芯片和背面VRM配置。从PSN的角度来看，即使使用高电流密度热点，3D IC CHIP-ON-VRM CASE也最能抑制PSN。本文还研究了不同参数（例如VRM-chip距离，芯片解耦电容器密度等）对PSN的影响。
In this paper, a design space exploration of power delivery networks is performed for multi-chip 2.5-D and 3-D IC technologies. The focus of the paper is the effective placement of the voltage regulator modules (VRMs) for power supply noise (PSN) suppression. Multiple on-package VRM configurations have been analyzed and compared. Additionally, 3D IC chip-on-VRM and backside-of-the-package VRM configurations are studied. From the PSN perspective, the 3D IC chip-on-VRM case suppresses the PSN the most even with high current density hotspots. The paper also studies the impact of different parameters such as VRM-chip distance on the package, on-chip decoupling capacitor density, etc. on the PSN.
