论文标题
用于表征大面积硅垫传感器的多功能系统，用于高粒度量热法
Versatile systems for characterization of large-area silicon pad sensors for highly-granular calorimetry
论文作者
论文摘要
使用硅垫传感器作为主要活性材料设计的高颗粒性热量表正在为CMS端盖热量表升级设计，并已提议用于CLIC，ILC和FCC-EE的电磁热量表。预计此类实验中的硅传感器可以覆盖O的大面积（1000 $ \ MATHRM {M^2} $）。它们通常是由6或8英寸晶片产生的，由几百个较小的单元组成，每个细胞都有O（0.1至1.1 $ \ Mathrm {cm^2} $）。目前，CMS端盖热量计升级处于原型阶段，目的是选择最终的传感器设计。需要灵活的系统才能使快速传感器表征尽可能接近操作条件，测试不同的原型以及在质量生产过程中进行质量控制。阵列系统由具有512个输入通道的主动开关矩阵PCB和针对每个传感器布局原型的被动探测卡组成。探针卡通过弹簧销与每个单独的垫子接触。阵列旨在测量不同偏置电压的泄漏电流和电容的电容，从而使整个传感器区域保持偏置。 Hexaboard探测卡遵循类似的原理：最终CMS检测器中预见的读数电子设备安装在PCB上，该PCB通过弹簧销钉与传感器接触。它用于使用辐照传感器执行噪声和电荷收集效率测量，而无需模块组件。我们介绍了阵列和六体系统的设计以及对不同CMS原型硅传感器进行的测量。我们还将结果与替代性多针设置进行了比较。
High-granularity calorimeters utilizing silicon pad sensors as main active material are being designed for the CMS endcap calorimeter upgrade and have been proposed for the electromagnetic calorimeters at CLIC, ILC and FCC-ee. The silicon sensors in such experiments are foreseen to cover a very large area of O(1000 $\mathrm{m^2}$). They are typically produced from 6- or 8-inch wafers and consist of a few hundred smaller cells, each with an area of O(0.1 to 1.1 $\mathrm{cm^2}$). Currently the CMS endcap calorimeter upgrade is in a prototyping phase with the aim of choosing the final sensor design. Flexible systems are needed for quick sensor characterization as close as possible to operating conditions, for testing different prototypes and for quality control during mass production. The ARRAY system consists of an active switching matrix PCB with 512 input channels and a passive probe card specific for each sensor layout prototype. The probe card makes contact with each individual pad through spring-loaded pins. ARRAY is designed to measure the leakage current and capacitance per-cell for different bias voltages, keeping the entire sensor area under bias. The Hexaboard probe card follows a similar principle: readout electronics foreseen to be used in the final CMS detector are mounted on a PCB that makes contact with the sensor through spring-loaded pins. It is used to perform noise and charge collection efficiency measurements with irradiated sensors without the need for module assembly. We present the design of the ARRAY and Hexaboard systems as well as measurements performed on different CMS prototype silicon sensors. We also compare the results with alternative multi-needle setups.
